For common temperature board material Tg130 FR4, ordinary copper 1OZ and gold thickness, ordinary board thickness(0.8mm,1.0mm,1.2mm,1.6mm) and demension(above 50 x 50mm,below 600 x 600mm),stanard trace/line width and space above 0.13/0.13mm, standard annul ring and hole diameter, no blind/buried holes, no impedance control, other specifications and tolerance are based on IPC class 2. The production time is as below: 

For Prototype and Small Volume (usually total board area is 1~5 ㎡)

For Mass Production (usually total board area is from 5 ㎡ to 300 ㎡)