Board Layer

1~14 Layers

Max Board Size

1200mm x 600mm

Board Thickness

0.2~6.4mm

Max Copper Thickness

6OZ(External) / 4OZ(Inner)

Min Line Width/Space

0.075mm

Min finished Hole Diameter

0.15mm

Layer Registration

3 mils

PTH Hole size Tolerance

±0.075mm

Min half PTH hole size

0.8mm

NPTH Hole size Tolerance

±0.05mm

Hole Position Deviation

±0.075mm

Slot Hole size or Board Outline Tolerance

±0.13mm

Board Thickness Tolerance

±10%(＞1.0mm)

±0.1mm(＜1.0mm)

Max Au Thickness of Immersion Gold

3u''

Max Au Thickness for Gold fingers

50u''

Min Bridge Width of Solder Mask  

4mils

Bent and Twist

≤0.75%

Aspect Ratio

10:1

V-cut

30°/45°

Surface Treatment

OSP,Pb HAL, RoHS HAL, Immersion Nickle / Gold,  Flash/Hard Gold, Immersion Silver,Immersion Tin

Board Material

FR4(Tg150,Tg170,CTI600,halogen free),Polyimide, Metal-Core,CEM-1,CEM-3,Rogers

Solder Mask Color

Green, Red, Blue, White, Black,Yellow,Purple

Special Technology

Carbon Ink, via plug, edge plating, edge chamferring, half-holes, blind/buried holes, impedance control,counter-sink holes, peelable solder mask